E3200 G3

E3200 G3.

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Produktdetails

1. Calculation and Memory CPU：2 × Intel ? Xeon ? Scalable Cascade Lake， Up to 205 W per unit, supporting NUMA Balance design Memory: 16 x DDR4 DIMM (RDIMM/LRDIMM), speed 2933 MT/s, maximum 1 TB; optional 8 x Autoteng ? DCPMM， Expand to 2 TB capacity memory 2. Storage and Expansion Disk position (flexible combination) SFF: 2 x SATA/SAS+4 x U.2 NVMe (front) M. 2:4 x SATA/NVMe (built-in boot disk) LFF: 4 × 3.5 "HDD (optional) RAID: Supports 0/1/10/5/6/50/60, optional 12 Gb RAID card with cache protection PCIe: up to 8 slots (x8/x16 flexible split), can accommodate 25/100 GbE smart network cards, GPUs, FPGAs, and other edge acceleration cards 3. Network and Interface OCP 3.0: Supports 10/25/100 GbE hot swappable network cards, compatible with RoCE v2 low latency networks Standard interface: 2 × 1 GbE electrical port (business) 1 × 1 GbE management port (HDM) 4 x USB 3.0, 2 x VGA, 1 x Console 4. Reliability and environmental adaptability Chassis: 440 × 450 × 87.5 mm (2U), with a depth of only 450 mm, can accommodate a 600 mm communication cabinet Wide temperature operation: long-term 0 ℃ -45 ℃, short-term -5 ℃ -50 ℃; Humidity 5% -90% (short-term) Anti harsh environment: meets ETSI EN 300 019 class 3.1, GB4798-3C1 corrosive gas, 3M2 vibration, and 7-intensity seismic resistance (telecom grade) Power supply: 1+1 redundant, supports 220 V AC/-48 V DC dual input, hot swappable and maintained Heat dissipation: 3+1 redundant fan, post maintenance, supports dynamic frequency conversion, no tool disassembly and assembly

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