1. Calculation and Memory CPU: 2x3rd generation Intel Xeon Scalable (Ice Lake), single chip up to 40 C/80 T, 3 11.2 GT/s UPI, TDP up to 270 W Memory: 32 x DDR4 RDIMM, speed 3200 MT/s, maximum capacity 4 TB; optional 16 x Aoteng persistent memory 200 series, maximum 12 TB 2. Storage (fully hot swappable) Disk position: -4 × 3.5 "SAS/SATA/NVMe (mixed) - Or 10 x 2.5 "SAS/SATA/NVMe (up to 10 x NVMe SSD) RAID: PERC 11/12 series (XR450C-M 2 GB, SR150, etc.), supports 0/1/5/6/10/50/60 and cache protection Startup: Dual M.2 SSD RAID1, hot swappable, BOSS-N1 3. Expansion and Networking PCIe: 6 x PCIe 4.0 (including 2 x OCP 3.0 network card slots), can accommodate 1 x dual width or 2 x single width GPUs, meeting AI inference and VDI acceleration requirements Network: Onboard 2 × 1 GbE+OCP 3.0 optional 25/100 GbE, NDK 4. Heat dissipation and power supply Fans: 7 hot swappable counter rotating fans, N+1 redundancy, supporting dynamic speed regulation Power supply: 550 W/900 W/1500 W Platinum/Titanium grade 1+1 hot swappable redundancy, supporting AC 100-240 V or HVDC 192-288 V
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