Shenzhen · Ekspor ke 8 negara +86 137 0631 0769  |  info@hsbyelectronics.com  | 
SR858V3

SR858V3

SR858V3.

Minta penawaran

Detail produk

4 4th generation Intel Xeon Scalable chips Single up to 32 cores/250 W, UPI 3.0 fully interconnected Example: Gold 6416H × 4 → 144 threads, turbo 4.2 GHz Memory and persistent memory 64 DDR5-5600, maximum 16 TB Support Intel Opotan PMem 300 series, bandwidth increased by 50% storage Front 24 × 2.5 "hot swappable, fully NVMe direct connection, optional 12 × AnyBay (SAS/SATA/NVMe hybrid) 2x7mm rear mounted+2xM.2 mirrored boot, supporting VROC/RAID 530-8i, etc I/O and GPU Up to 12 x PCIe 5.0 slots (including 6 x 16), can accommodate 2 dual width 350 W GPUs or 4 single width 75 W GPUs OCP 3.0 network card, supports 25/40/100 GbE, built-in 2 × 10 GbE-T RAS and Management Cellular cooling, hot swappable redundant fans; 800 W/1100 W/1600 W 80 PLUS Platinum Power Supply XClarity Controller 2 + Redfish, Support remote KVM, batch firmware, PFR hardware Root of Trust typical scenario Large OLTP/OLAP, in memory database SAP HANA、 High density virtualization, AI inference, cloud computing resource pool

Informasi pemesanan

Sertakan nomor part, jumlah, dan target tanggal. Kami konfirmasi stok atau lead time, menawarkan alternatif bila kosong, dan menerbitkan invoice komersial dengan HS code.

Produk terkait

Butuh penawaran atau part yang sulit dicari?

Kirim BOM atau nomor part; kami balas dalam satu hari kerja.

Hubungi kami