Electronic components & carbon fibre parts · Shenzhen, China +86 137 0631 0769  |  info@hsbyelectronics.com
R2700 G3

R2700 G3

R2700 G3 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.

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Product details

1. Calculation and Memory CPU:2 × Intel ? Xeon ? Scalable (1/2 generation), with a maximum of 28 cores and 56 threads per chip, a clock speed of 3.6 GHz, UPI of 10.4 GT/s, and a maximum of 56 cores and 112 threads per machine Memory: 16 x DDR4 DIMM, speed 2933 MT/s, maximum 2 TB (LRDIMM); Support 8 x Aoteng ? DCPMM, Expand to 4 TB capacity memory 2. Storage and RAID Disk position: Front 4 × 3.5 "or 8 × 2.5" SAS/SATA/NVMe Rear 2 × 2.5 "(optional) RAID: Onboard support for 0/1/10/5; Optional 12 Gb RAID card, supports 0/1/10/5/6/50/60, with cache protection 3. Expansion and Networking PCIe 3.0: 4 available slots (including dedicated slots for array cards/network cards), can accommodate GPU, FC, 25/40 GbE, etc Network: Onboard 2 × 1 GbE (Intel I350) Support OCP 3.0 network card (1/10/25 GbE) hot plugging Cloud Network Features: Supports VXLAN, SRIOV, NCSI, providing virtual network offloading and secure isolation for cloud based multi tenant scenarios 4. Reliability and energy efficiency Power supply: 550 W/800 W/1200 W 80Plus Platinum, 1+1 redundancy (optional), 94% conversion efficiency Heat dissipation: 5 x hot swappable fans, N+1 redundancy; 3D temperature array intelligent speed regulation, no derating below 35 ℃ MTBF:> 100 000 h, Support continuous operation for 7 × 24 hours 5. Management and Deployment HDM: Agent free out of band management, supporting Redfish/IPMI/SNMP, virtual KVM, and batch firmware upgrades FIST: New H3C Full Lifecycle Deployment Tool, Zero Contact Online, Template based OS Installation Security: TPM 2.0/TCM 1.0, Intel TXT, firmware digital signature to resist malicious software attacks

Ordering information

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