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ThinkSystem SR850

ThinkSystem SR850

ThinkSystem SR850 is supplied by HuaShengBoYe with verified origin and traceable batch information. We quote against your BOM, confirm packaging and date codes, and ship worldwide from Shenzhen.

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Product details

Form: 2U rack mounted, with a chassis depth of 782mm, supporting standard 19 inch cabinet slide rail installation; Fully modular and tool free maintenance design. computing platform CPU: 4 second-generation Intel Xeon Scalable (Cascade Lake SP), available in Bronze 3106 to Platinum 8280, with a maximum of 112 cores and 224 threads, and a maximum TDP of 205 W. ? Memory: 48 x DDR4-2933 DIMM, maximum 6 TB (128 GB LRDIMM x 48), supports Intel Optane PMem 200 series, and increases memory bandwidth by 60%. Storage and I/O ? Disk position: - Front end 24 × 2.5 "(including 8 × NVMe U.2 support) or 12 × 3.5" hot swappable; - Rear 2 × 2.5 "hot swappable; - Internal 2xM.2 SATA/NVMe (RAID 1 system disk). RAID: onboard 8 x SATA soft RAID 0/1/5/10; Optional hard RAID cards such as 730-8i/930-16i/940-16i, with 2-4 GB of cache and support for RAID 50/60. PCIe: Up to 9 x PCIe 3.0 (including 1 x OCP 3.0), compatible with high-speed network cards, FC HBAs, GPUs, or FPGA expansion cards. Network and Management ? Network: onboard 2 × 10 GbE SFP+or 2 × 1 GbE RJ-45; OCP 3.0 supports 25/40/100 GbE and FC HBA. ? Management: Integrated XClarity Controller BMC+XClarity Administrator, supporting Redfish, KVM over IP, firmware batch upgrade, and cloud energy consumption monitoring. Power supply and heat dissipation ? Power supply: 750 W/1100 W/1600 W 80 PLUS Platinum/Titanium Hot swappable Redundant Power Supply; Supports 240V DC. ? Heat dissipation: Partition fan wall, N+1 redundancy, supports long-term operation at 35-40 ° C, high-density deployment at cabinet level without hotspots.

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