HI-8586PSI Transceiver Chip-Receiver Chip-Driver Chip — Основные характеристики: manufacture:, category:, description:, package:.
| Manufacture: | NXP |
|---|---|
| Category: | Single chip microcontroller/microcontroller |
| Description: | Layerscape 64-bit Arm Cortex-A72, 16-core, 2.0GHz, -40 to 105C, Security enabledArm Cortex-A72Core: Number of cores (SPEC)16SRAM (kB)256支持外部存储器DDR4 SDRAMSerial Communication3 x SPI, 4 x UART, 8 x I?CI2S-CAN2Serial Audio Interface (SAI)-Ethernet57GPIOUSB ControllersTimer (bits)-PWM-ADC [Number, bits]Supply Voltage [Min to Max] (V)Ambient Operating Temperature (Min to Max) (℃) |
| Package: | FCPBGA-1517 |
HI-8586PSI is an integrated circuit (IC) produced by Holt Integrated Circuits Inc., mainly used for interface drivers, receivers, and transceivers. The following is a detailed description and features of the product: Type: Integrated Circuit (IC), belonging to the interface driver category. Protocol: Supports ARINC429 protocol, which is a widely used serial communication protocol in the field of aviation electronics. Number of drivers/receivers: There are 2 drivers and 0 receivers. Power supply voltage: The working voltage range is ± 12V to 15V. Working temperature: The suitable temperature range is -40 ° C to 85 ° C, meeting the needs of industrial and extended temperature applications. Installation type: Surface mount type, easy to install on printed circuit boards (PCBs). Encapsulation/Shell: Adopting 8-SOIC (0.154 ", 3.90mm wide) exposed pad encapsulation, the supplier's device packaging is 8-ESOIC. Basic product number: HI-8586. Moisture Sensitivity Level (MSL): 1 (unlimited). ECCN：EAR99。 HTSUS：8542.39.0060。 This product is favored by the market for its compact packaging, low power consumption, CMOS/TTL logic pins, and multiple temperature range options. HI-8586PSI provides a direct ARINC 429 line driver interface and has a logic input controlled slope control function for the line driver. In addition, it also offers plastic and ceramic packaging options, as well as enhanced SOIC packaging to meet different application needs
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