project parameters Form: 1U rack, dual channel 1/2 fourth/fifth generation Xeon SP CPU, with a maximum of 60 cores/385 W per unit, 3 x UPI 16 GT/s Memory 32 × DDR5 RDIMM, speed 4800 MT/s, maximum 8 TB; supports ECC, memory mirroring, 12 channel symmetric topology Local storage of 10 × 2.5 "SAS/SATA/NVMe (maximum 10 × NVMe) or 4 × 3.5" SATA; Optional 32 × E1. S/20 × E3. S; Dual M.2 NVMe RAID1 RAID optional PERC 12 (H965i, etc.) 0/1/10/5/50/6/60, supercapacitor cache protection PCIe 5 expansion slots: 3 standard slots (2 x PCIe 5.0 x16+1 x PCIe 4.0 x8)+2 OCP 3.0 network card dedicated slots, all supporting hot swapping Network onboard 2 × 1 GbE, OCP 3.0 optional 25/100/200/400 GbE, NDK smart network card Power supply 900 W/1500 W/2000 W Platinum/Titanium 1+1 redundancy, supporting AC 100-240 V, HVDC 192-288 V, 380 V HVDC, -48 V DC 8 hot swappable counter rotating fans for heat dissipation, N+1 redundancy, using "heat pipe extension" technology, with a 50% increase in single heat sink capacity, and long-term full frequency operation at 35 ℃ without derating
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