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R2900 G3

R2900 G3

R2900 G3.

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1. Calculation and Memory CPU:2 × Intel ? Xeon ? Scalable 1/2 Generation (or Lanqijin Catch) ?), Single maximum 20 cores, 125 W Memory: 16 x DDR4 DIMM, speed 2933 MT/s, maximum 2 TB; supports 8 x Autoteng ? DCPMM, Expand to 4 TB capacity memory 2. Storage capacity Disk position: Front 12 × 3.5 "or 25 × 2.5" (including 16 × NVMe options) Rear 2 × 2.5 "+2 × 3.5" combination, with a maximum of 31 hard drives for the entire machine RAID: Onboard support for 0/1/10/5; Optional 12 Gb RAID card, supports 0/1/10/5/6/50/60, cache up to 4 GB FBWC Startup disk: Dual M.2 SATA/NVMe RAID1 3. Expansion and Networking PCIe 3.0: 8 available slots (including dedicated slots for array cards/network cards), can accommodate GPU, FC, 25/40 GbE GPU: Up to 2 dual width GPUs per node, suitable for lightweight AI inference/VDI Network: Onboard 1 × 1 GbE management port Optional mLOM 4 × 1 GE or OCP 3.0 network card (1/10/25 GbE) 4. Reliability and energy efficiency Power supply: 550 W-1600 W Platinum/Titanium 1+1 redundancy, optional -48 V DC/336 V HVDC Heat dissipation: Hot swappable redundant fan, operating temperature range of 5 ℃ -50 ℃ (slightly different depending on configuration) MTBF:> 100 000 h, Certified by CCC, CE, CB, CECP, etc 5. Management and Security HDM: Agent free out of band management, supporting Redfish/IPMI/SNMP, virtual KVM, and batch firmware upgrades FIST: New H3C Full Lifecycle Deployment Tool, Zero Contact Online, Template based OS Installation Security: TCM/TPM 2.0, Chassis Intrusion Detection, Firmware Digital Signature

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