1. Hardware Overview Processor: 2 third-generation Intel Xeon Scalable chips, with a maximum of 40 cores/270 W per chip and an 8-channel memory design Memory: 32 DDR4 RDIMM/LRDIMMs, speed 3200 MT/s, maximum 4 TB (LRDIMM) or 2 TB (RDIMM); Supports Intel Opotan Persistent Memory 200 Series (up to 16 TB) storage Front end: up to 10 × 2.5 "SAS/SATA/NVMe (153 TB) or 4 × 3.5" SAS/SATA (64 TB) Rear: Up to 2 x 2.5 "NVMe/SAS (30.7 TB) RAID：PERC H345/H745/H755/H755N、HBA355i、S150； BOSS-S2 Dual M.2 NVMe Boot Disk PCIe: 3 PCIe 4.0 slots (x16/x8 combination), optional full height or half height, supporting 3 × 75W single width GPU Network: Onboard 2 × 1 GbE LOM+1 × OCP 3.0 (optional 25/100 GbE) Power supply: Hot swappable redundancy, 600 W/800 W/1100 W/1400 W platinum/titanium grade AC or HVDC Heat dissipation: Standard/high-performance fan wall, optional direct liquid cooling (DLC) solution, ensuring continuous turbo frequency of 270 W CPU Size: 1U, 42.8 mm × 482 mm × 748 mm (including baffle), maximum weight 18.6 kg
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