4 second-generation Intel Xeon Scalable chips Up to 4 × 28 cores (Platinum 8280) or 4 × 24 cores (Platinum 8260), single CPU 205 W Adopting Mesh full interconnection: Each CPU is directly connected to other CPUs through 3 UPIs, and the performance of multi-threaded applications is improved by about 20% compared to Ring architecture Ultra large memory and persistent memory 48 DIMMs, maximum 15 TB (24 x 512 GB Intel Optane DC Persistent Memory+24 x 128 GB RDIMM) Frequency 2933 MHz, supports ECC, memory mirroring Rank Sparing Flexible storage and I/O Front frame: Up to 16 x 2.5 "SAS/SATA/NVMe (including 8 x NVMe pass through)+2 x M.2 mirror boot Expansion: 8 x PCIe 3.0 (including 4 x x16)+1 x ML2+1 x LOM, compatible with GPU, FC, 25/40/100 GbE High availability and maintainability Hot swappable redundant fan, 750 W/1100 W/1600 W/2000 W 80 PLUS platinum power supply Optical path diagnosis, PFA fault prediction, TPM 2.0, ThinkShield security suite; XClarity Controller provides remote KVM and batch firmware updates Environmental Specifications ASHRAE A2-A4 temperature level, continuous operation at 35 ° C without frequency reduction; Noise 5.8-7.0 Bel
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